Patent Assignment
Reel/Frame 043094/0957
Assignment of Assignor's Interest
Recorded: 2017-07-25
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Wafer Dicing