IP Library Assignment 043106/0872
Patent Assignment
Reel/Frame 043106/0872

Assignment of Assignor's Interest

Recorded: 2017-07-27 Pages: 10
Assignors
CHANG, FENG-YI
Executed: 2017-07-21
LEE, FU-CHE
Executed: 2017-07-21
CHEN, CHIEH-TE
Executed: 2017-07-21
CHANG, YI-CHING
Executed: 2017-07-21
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
6TH FLOOR, PODIUM OF ELECTRIC POWER COMPANY BUILDING, MEILING STREET, JINJIANG CITY, QUANZHOU CITY,FUJIAN PROVINCE, CHINA
Covered Property (1)
Method of Forming Semiconductor Device
Application: 15/660,967 →
Publication: US 2018/0374702
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address of Second Assignee Jun 3, 2019
From: FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
To: FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
Reel/Frame 049342/0633 →