Method of forming semiconductor device
A method of forming a semiconductor device includes the following steps. First of all, a material layer is formed on a substrate, and a sidewall image transferring process is performed to form plural first mask patterns on the material layer, with the first mask patterns parallel extended along a first direction. Next, a pattern splitting process is performed to remove a portion of the first mask patterns to form plural second openings, with the second openings parallel extended along a second direction, across the first mask patterns. Then, the material layer is patterned by using rest portions of the first mask patterns as a mask to form plural patterns arranged in an array.
1. A method of forming a semiconductor device, comprising:
providing a material layer on a substrate;
performing a spacer patterning process to form a plurality of first mask patterns parallel with each other on the material layer, the first mask patterns extending along a first direction;
performing a pattern splitting process to remove a portion of the first mask patterns to form a plurality of second openings, the second openings parallel with each other and extending along a second direction, across the first mask patterns; and
patterning the material layer by using remaining portion of the first mask patterns as a mask, to form a plurality of patterns in an array arrangement.
2. The method of forming a semiconductor device according to claim 1 , wherein the pattern splitting process comprises:
forming a sacrificial layer and a mask layer covering on the first mask patterns, the sacrificial layer is filled between each first mask patterns;
partially removing the mask layer to form a plurality of first primary openings extended along the second direction in the mask layer;
patterning the sacrificial layer and the first mask patterns to form a portion of the second openings;
forming another sacrificial layer and another mask layer covering on the first mask patterns, the another sacrificial layer is filled between each first mask patterns;
partially removing the another mask layer to form a plurality of second primary openings extended along the second direction in the another mask layer; and
patterning the another sacrificial layer and the first mask patterns to form another portion of the second openings.
3. The method of forming a semiconductor device according to claim 1 , further comprising:
forming a mask structure covering on the first mask patterns;
partially removing the mask structure to form a plurality of first primary openings extended along the second direction in the mask structure;
further removing the mask structure to form a plurality of second primary openings extended along the second direction in the mask structure; and
patterning the first mask patterns to form the second openings.
4. The method of forming a semiconductor device according to claim 1 , wherein the second direction is perpendicular to the first direction.
5. The method of forming a semiconductor memory device according to claim 1 , wherein the second direction is not perpendicular to the first direction.
6. The method of forming a semiconductor device according to claim 1 , wherein each of the patterns comprises a parallelogram-shape.
7. The method of forming a semiconductor device according to claim 1 , wherein each of the patterns comprises a rectangular-shape or a square-shape.
8. The method of forming a semiconductor device according to claim 1 , wherein the material layer comprises a conductive layer.
9. The method of forming a semiconductor device according to claim 8 , further comprising:
forming a dielectric layer on the substrate;
forming a plurality of plugs in the dielectric layer; and
forming the conductive layer on the plugs and the dielectric layer, wherein the patterns are in alignment with the plugs to directly contact to the plug.
10. The method of forming a semiconductor device according to claim 1 , wherein the material layer comprises a hard mask layer.
11. The method of forming a semiconductor device according to claim 10 , further comprising:
forming a dielectric layer on the substrate;
forming a plurality of plugs in the dielectric layer;
forming a conductive layer on the plugs and the dielectric layer, wherein the hard mask layer is formed on the conductive layer; and
patterning the conductive layer by using the patterns as a mask, to form a plurality of conductive patterns.
12. The method of forming a semiconductor device according to claim 10 , wherein the conductive patterns are in alignment with the plugs to directly contact to the plug.
13. The method of forming a semiconductor device according to claim 2 , wherein the substrate has a cell region and a periphery region, and first mask patterns and the second openings are formed within the cell region.
14. The method of forming a semiconductor device according to claim 13 , wherein the material layer is formed on the cell region and the periphery region, and the method further comprises:
forming a plurality of third mask patterns on the material layer, within the periphery region.
15. The method of forming a semiconductor device according to claim 14 , wherein the third mask patterns are formed while performing the pattern splitting process.
16. The method of forming a semiconductor device according to claim 14 , wherein the forming of the third mask patterns comprises:
forming the sacrificial layer and the mask layer covering the cell region and the periphery region of the substrate;
forming a third primary patterns extended along the second direction on the mask layer, within the periphery region;
patterning the sacrificial layer to form a portion of the third mask patterns;
forming the another sacrificial layer and the another mask layer covering the cell region and the periphery region of the substrate;
forming a fourth primary patterns extended along the second direction on the another mask layer, within the periphery region; and
patterning the another sacrificial layer to form another portion of the third mask patterns.