Patent Assignment
Reel/Frame 043132/0480
Assignment of Assignor's Interest
Recorded: 2017-07-28
Pages: 4
Assignors
YI, MOON HE
Executed: 2017-07-24
KIM, BYOUNG CHAN
Executed: 2017-07-24
BAEK, YONG HO
Executed: 2017-07-24
CHO, JUNG HYUN
Executed: 2017-07-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Name of the First Inventor Previously Recorded on Reel 043132 Frame 0480. Assignor(S) Hereby Confirms the Assignment.
Sep 19, 2017
From: YI, MOON HEE; KIM, BYOUNG CHAN; BAEK, YONG HO; CHO, JUNG HYUN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 043899/0815 →
Assignment of Assignor's Interest
Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →