Patent Assignment
Reel/Frame 043174/0248
Assignment of Assignor's Interest
Recorded: 2017-08-02
Pages: 4
Assignor
KIM, HYOUNG IL
Executed: 2017-04-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multi-Package Integrated Circuit Assembly with Package on Package Interconnects