Patent Assignment
Reel/Frame 043195/0076
Assignment of Assignor's Interest
Recorded: 2017-08-04
Pages: 22
Assignors
LEE, KAI-LIN
Executed: 2017-08-02
LEE, ZHI-CHENG
Executed: 2017-08-02
CHEN, WEI-JEN
Executed: 2017-07-13
KANG, TING-HSUAN
Executed: 2017-08-02
HE, REN-YU
Executed: 2017-08-02
HUANG, HUNG-WEN
Executed: 2017-08-02
CHEN, CHI-HSIAO
Executed: 2017-08-02
YANG, HAO-HSIANG
Executed: 2017-08-02
SHIH, AN-SHIH
Executed: 2017-08-02
HSIEH, CHUANG-HAN
Executed: 2017-08-02
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Fabricating Method of Fin Structure with Tensile Stress and Complementary Finfet Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.