Patent Assignment
Reel/Frame 043210/0576
Assignment of Assignor's Interest
Recorded: 2017-08-07
Pages: 4
Assignors
HO, YU-HSUAN
Executed: 2017-08-02
TSAI, MING-CHIH
Executed: 2017-08-02
HSIEH, MING-HUNG
Executed: 2017-08-02
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Pressure Sensor and Manufacturing Method Thereof