Patent Assignment
Reel/Frame 043249/0938
Assignment of Assignor's Interest
Recorded: 2017-08-09
Pages: 7
Assignors
CHOI, JI MIN
Executed: 2017-06-20
LEE, DONG RYUL
Executed: 2017-06-20
LEE, HO OUK
Executed: 2017-06-20
KIM, JI YOUNG
Executed: 2017-06-20
CHO, CHANG HYUN
Executed: 2017-06-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having a Trench Type Device Isolation Film and Method for Fabricating the Same