Patent Assignment
Reel/Frame 043324/0795
Assignment of Assignor's Interest
Recorded: 2017-08-17
Pages: 4
Assignors
TAI, CHIH-HSUAN
Executed: 2017-08-08
KUO, TING-TING
Executed: 2017-08-08
HUANG, YU-CHIH
Executed: 2017-08-08
CHEN, CHIH-HUA
Executed: 2017-08-08
TSAI, HAO-YI
Executed: 2017-08-08
LIU, CHUNG-SHI
Executed: 2017-08-08
YU, CHEN-HUA
Executed: 2017-08-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming Package Structure