IP Library Assignment 043335/0419
Patent Assignment
Reel/Frame 043335/0419

Assignment of Assignor's Interest

Recorded: 2017-08-18 Pages: 5
Assignors
BASKER, VEERARAGHAVAN S.
Executed: 2015-11-20
CHENG, KANGGUO
Executed: 2015-11-19
STANDAERT, THEODORUS E.
Executed: 2015-11-19
WANG, JUNLI
Executed: 2015-11-19
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Fin Pitch Scaling for High Voltage Devices and Low Voltage Devices on the Same Wafer
Application: 15/680,697 →
Publication: US 2017/0372968
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073658/0462 →
Change of Name Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0849 →