Patent Assignment
Reel/Frame 043362/0296
Assignment of Assignor's Interest
Recorded: 2017-08-23
Pages: 4
Assignors
MAO, YI-CHAO
Executed: 2017-07-11
CHANG, CHIN-CHUAN
Executed: 2017-07-11
LIN, JING-CHENG
Executed: 2017-07-11
CHANG, WEN-HUA
Executed: 2017-07-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Grinding Element, Grinding Wheel and Manufacturing Method of Semiconductor Package Using the Same