Patent Assignment
Reel/Frame 043379/0312
Assignment of Assignor's Interest
Recorded: 2017-08-24
Pages: 3
Assignor
KAWASE, YUSUKE
Executed: 2017-07-21
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device Having Buffer Layer