IP Library Assignment 043427/0223
Patent Assignment
Reel/Frame 043427/0223

Assignment of Assignor's Interest

Recorded: 2017-08-28 Pages: 4
Assignors
KIM, HYOUNG IL
Executed: 2017-08-11
PON, FLORENCE
Executed: 2017-08-11
XU, YI
Executed: 2017-08-11
CAI, YUHONG
Executed: 2017-08-11
LAI, MIN-TIH
Executed: 2017-08-13
CRAFT, LEO
Executed: 2017-08-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Semiconductor Package with Thermal Fins
Application: 15/688,662 →
Publication: US 2019/0067156
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072792/0592 →