Patent Assignment
Reel/Frame 072792/0592
Assignment of Assignor's Interest
Recorded: 2025-09-17
Pages: 70
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties
(25)
Apparatus, Non-Volatile Memory Storage Device and Method for Detecting Drift in Non-Volatile Memory
Persistent Host Memory Buffer
Stacked Memory Chip Device with Enhanced Data Protection Capability
Semiconductor Package with Thermal Fins
Storage System, Computing System, and Methods Thereof
Combining Presence Detect Pin with Device Management Bus Reset and Power Disable
Time Tracking with Patrol Scrub
Techniques to Direct Access Requests to Storage Devices
Techniques to Predict Memory Bandwidth Demand for a Memory Device
Storage System with Interconnected Solid State Disks
3D Package Having Edge-Aligned Die Stack with Direct Inter-Die Wire Connections
Discrete Circuit Having Cross-Talk Noise Cancellation Circuitry and Method Thereof
Storage System with Interconnected Solid State Disks
Semiconductor Package Having Sealant Bridge
Inductor/Core Assemblies for Integrated Circuits
Strained Thin Film Transistors
Interposer for Electrically Connecting Stacked Integrated Circuit Device Packages
High Density Die Package Configuration on System Boards
Peripheral Inductors
Stacked Die Semiconductor Package Spacer Die
Computer Program Product, System, and Method to Manage Access to Storage Resources from Multiple Applications
Tunable Passive Semiconductor Elements
Storage System with Interconnected Solid State Disks
Method and Apparatus for Performing Multi-Object Transformations on a Storage Device
Integrated Circuit Components with Dummy Structures
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 28, 2017
From: KIM, HYOUNG IL; PON, FLORENCE; XU, YI; CAI, YUHONG
To: INTEL CORPORATION
Reel/Frame 043427/0223 →
Assignment of Assignor's Interest
Oct 16, 2017
From: XU, YI; PON, FLORENCE; SHE, YONG
To: INTEL CORPORATION
Reel/Frame 043871/0382 →
Assignment of Assignor's Interest
Oct 24, 2017
From: HILLIER, PHILIP; RYDEN, JEFFREY W.; SWAMINATHAN, MUTHUKUMAR P.; KWOK, ZION S.
To: INTEL CORPORATION
Reel/Frame 044280/0429 →
Assignment of Assignor's Interest
Nov 1, 2017
From: GUIM BERNAT, FRANCESC
To: INTEL CORPORATION
Reel/Frame 044346/0309 →
Assignment of Assignor's Interest
Nov 1, 2017
From: GUIM BERNAT, FRANCESC
To: INTEL CORPORATION
Reel/Frame 044346/0268 →
Assignment of Assignor's Interest
Nov 8, 2017
From: ALAMEER, HUSSEIN; KANG, UKSONG; CRISS, KJERSTEN E.; AGARWAL, RAJAT
To: INTEL CORPORATION
Reel/Frame 044074/0372 →
Assignment of Assignor's Interest
Nov 9, 2017
From: PIOCH, MARCIN; KARKRA, KAPIL; WYSOCKI, PIOTR; PTAK, SLAWOMIR
To: INTEL CORPORATION
Reel/Frame 044077/0652 →
Assignment of Assignor's Interest
Dec 6, 2017
From: LOEWEN, MYRON D.; MORNING-SMITH, ANDREW W.; CONSTANTINE, ANTHONY M.
To: INTEL CORPORATION
Reel/Frame 044723/0684 →
Assignment of Assignor's Interest
Jan 29, 2019
From: KWOK, ZION S.; VANAPARTHY, SANTHOSH K.; MOTWANI, RAVI H.
To: INTEL CORPORATION
Reel/Frame 048165/0064 →
Assignment of Assignor's Interest
Jul 30, 2019
From: LI, PENG; KHAN, JAWAD B.; TRIKA, SANJEEV N.
To: INTEL CORPORATION
Reel/Frame 049904/0949 →
Assignment of Assignor's Interest
Oct 14, 2019
From: BOYD, JAMES A.; CARROLL, JOHN W.; TRIKA, SANJEEV N.
To: INTEL CORPORATION
Reel/Frame 050706/0561 →
Assignment of Assignor's Interest
Nov 26, 2019
From: PADMANABHAN RAMALEKSHMI THANU, DINESH; DHAVALESWARAPU, HERMANTH K.; GUTHIKONDA, VENKATA SURESH; BEATTY, JOHN J.
To: INTEL CORPORATION
Reel/Frame 051114/0344 →
Assignment of Assignor's Interest
Jan 16, 2020
From: LIN, KEVIN L.; MCKUBRE, NICHOLAS JAMES HAROLD; THEN, HAN WUI
To: INTEL CORPORATION
Reel/Frame 051624/0413 →
Assignment of Assignor's Interest
Apr 18, 2022
From: MAJHI, PRASHANT; RACHMADY, WILLY; DOYLE, BRIAN S.; SHARMA, ABHISHEK A.
To: INTEL CORPORATION
Reel/Frame 059628/0195 →