High density die package configuration on system boards
A high density die package configuration is shown for use on system boards. In one example, an apparatus includes a system board, a first package mounted to the system board, a second package mounted to the system board, and an interface package mounted between the first and the second package and coupled directly to the first package and to the second package through the respective first and second packages.
1. An apparatus comprising:
a system board;
a first package mounted to the system board;
a second package mounted to the system board; and
an interface package mounted between the first and the second package and coupled directly to the first package and to the second package.
2. The apparatus of claim 1 , wherein the interface package is mounted to a top surface of both the first and the second packages and wherein the interface package is coupled to the first and second packages through the respective top surfaces.
3. The apparatus of claim 2 , wherein each top surface comprises a land coupled to a through mold via and wherein the interface package comprises a solder ball configured to be coupled to the land.
4. The apparatus of claim 2 , wherein the first and second packages are covered in a mold compound and have through-mold vias from the respective top surfaces to respective routing layers of the respective package and wherein the interface package is coupled through the through-mold vias to the routing layers.
5. The apparatus of claim 4 , wherein the interface package is further coupled to the system board through through-mold vias of the respective first and second packages.
6. The apparatus of claim 5 , wherein the interface package is coupled to the routing layers of the respective package and from the routing layers through the system board mount to the system board.
7. The apparatus of claim 1 , wherein the interface package is further coupled to the system board through the respective first and second packages.
8. The apparatus of claim 1 , further comprising a first redistribution layer over the first package and a second redistribution layer over the second package and wherein the interface package is mounted over the first and the second redistribution layers and is coupled to the packages through the respective redistribution layers.
9. The apparatus of claim 1 , wherein the first and second packages each comprise a ball grid array through which the respective package is mounted to the system board and wherein the interface package comprises a ball grid array through which the interface package is mounted to each package.
10. An apparatus comprising:
a system board having a socket;
a first package mounted to the system board;
a second package mounted to the system board; and
an interface package having a substrate including a connector at an end of the substrate configured to connect to the socket,
wherein the interface package is mounted to the socket between the first and the second package orthogonal to the system board and coupled to the first and the second package through the system board.
11. The apparatus of claim 10 wherein the connector has a plurality of conductive fingers on a system board and the socket has mating conductive fingers.
12. The apparatus of claim 10 , wherein the socket is filled with reflowable solder.
13. The apparatus of claim 10 , wherein the system board defines a cavity below and between the first and second package and wherein the socket is in the cavity.
14. The apparatus of claim 10 , wherein the socket is coupled to patterned copper layers in the system board.
15. The apparatus of claim 10 , further comprising a controller die mounted to the interface package substrate and coupled to the connector through the interface package substrate.
16. The apparatus of claim 10 , further comprising conductive paste between the socket and the connector to attach the interface package to the socket.
17. The apparatus of claim 10 , wherein the first and second package each contain stacked memory dies.
18. A solid state memory drive comprising:
a system board having an end connector to attach to a main board, wherein the drive provides memory to the main board;
interface chips coupled to the end connector;
a memory array controller to manage higher level functions of the drive and coupled to the interface chips;
a first memory package mounted to the system board;
a second memory package mounted to the system board; and
an interface package mounted between the first memory package and the second memory package coupled directly to the first memory package and to the second memory package, the interface package coupled to the memory array controller through the first and second memory packages.
19. The drive of claim 18 , wherein the interface package is mounted to a top surface of both the first and the second memory packages and wherein the interface package is coupled to the first and second memory packages through the respective top surfaces.
20. The drive of claim 18 , wherein the first and second memory packages are covered in a mold compound and have through-mold vias from the respective top surface to respective routing layers of the respective memory package and wherein the interface package is coupled through the through-mold vias to the routing layers to connect to memory of each memory package and to the memory array controller.