Patent Assignment
Reel/Frame 056858/0342
Assignment of Assignor's Interest
Recorded: 2021-07-14
Pages: 4
Assignors
DOMINGUEZ, JUAN E.
Executed: 2017-09-12
KIM, HYOUNG IL
Executed: 2017-09-08
KHALAF, BILAL
Executed: 2017-09-11
MEYERS, JOHN GARY
Executed: 2017-09-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
High Density Die Package Configuration on System Boards
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.