IP Library Assignment 044074/0372
Patent Assignment
Reel/Frame 044074/0372

Assignment of Assignor's Interest

Recorded: 2017-11-08 Pages: 8
Assignors
ALAMEER, HUSSEIN
Executed: 2017-11-07
KANG, UKSONG
Executed: 2017-11-07
CRISS, KJERSTEN E.
Executed: 2017-11-07
AGARWAL, RAJAT
Executed: 2017-11-07
WU, WEI
Executed: 2017-11-07
HALBERT, JOHN B.
Executed: 2017-11-07
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Stacked Memory Chip Device with Enhanced Data Protection Capability
Application: 15/640,182 →
Publication: US 2019/0004909
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072792/0592 →