IP Library Assignment 051114/0344
Patent Assignment
Reel/Frame 051114/0344

Assignment of Assignor's Interest

Recorded: 2019-11-26 Pages: 8
Assignors
DHAVALESWARAPU, HERMANTH K.
Executed: 2019-11-18
GUTHIKONDA, VENKATA SURESH
Executed: 2019-11-19
BEATTY, JOHN J.
Executed: 2019-11-15
AN, YONGHAO
Executed: 2019-11-21
CARTAS AYALA, MARCO AURELIO
Executed: 2019-11-18
GARNER, LUKE J.
Executed: 2019-11-18
LI, PENG
Executed: 2019-11-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Semiconductor Package Having Sealant Bridge
Application: 16/614,765 →
Publication: US 2020/0185290
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072792/0592 →