Patent Assignment
Reel/Frame 043871/0382
Assignment of Assignor's Interest
Recorded: 2017-10-16
Pages: 3
Assignors
XU, YI
Executed: 2017-10-13
PON, FLORENCE
Executed: 2017-10-11
SHE, YONG
Executed: 2017-10-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
3D Package Having Edge-Aligned Die Stack with Direct Inter-Die Wire Connections
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.