Peripheral inductors

1. An integrated circuit (IC) device comprising a die, the die comprising:

an inductor extending around at least a portion of a periphery of the die, the inductor having a first end and a second end;

an insulating material that separates the first end of the inductor from the second end of the inductor; and

circuitry in an interior of the inductor, the circuitry comprising a plurality of transistors, wherein the first end of the inductor is electrically coupled to the circuitry in the interior of the inductor, and a footprint of the circuitry is inside a footprint of the inductor.

2. The IC device of claim 1 , wherein the inductor is included in a metallization stack of the die.

3. The IC device of claim 2 , wherein the inductor has the first end in a first layer of the metallization stack, the inductor has the second end in a second layer of the metallization stack, and the first layer is different from the second layer.

4. The IC device of claim 2 , wherein the first end of the inductor spans multiple interconnect layers of the metallization stack.

5. The IC device of claim 1 , wherein the inductor and the insulating material provide a hermetic seal for the die.

6. The IC device of claim 1 , wherein the circuitry includes a buck-boost converter.

7. The IC device of claim 1 , wherein the second end of the inductor is electrically coupled to the circuitry in the interior of the inductor.

8. The IC device of claim 1 , wherein the die further includes conductive contacts, and the first end of the inductor is electrically coupled to a conductive contact.

9. A die, comprising:

a conductive structure in a periphery of the die, the conductive structure having a first end and a second end, wherein the conductive structure is proximate to at least two edges of the die, and the conductive structure does not form a closed loop;

an insulating material that separates the first end of the conductive structure from the second end of the conductive structure; and

circuitry in an interior of the conductive structure, the circuitry comprising a plurality of transistors, wherein the first end of the conductive structure is electrically coupled to the circuitry in the interior of the conductive structure, and a footprint of the circuitry is inside a footprint of the conductive structure.

10. The die of claim 9 , wherein the insulating material includes a nitride.

11. The die of claim 9 , wherein the conductive structure and the insulating material provide a hermetic seal for the die.

12. The die of claim 9 , further comprising:

a guard ring extending around the periphery of the die, wherein the conductive structure is in an interior of the guard ring.

13. The die of claim 12 , wherein the guard ring provides a hermetic seal for the die.

14. The die of claim 9 , further comprising:

conductive contacts at a face of the die, wherein the second end of the conductive structure is electrically coupled to a conductive contact.

15. A computing device, comprising:

an integrated circuit (IC) package, wherein the IC package includes a die, and the die includes an inductor extending around at least a portion of a periphery of the die, the inductor having a first end and a second end, and the die further includes:

an insulating material that separates the first end of the inductor from the second end of the inductor, and

circuitry in an interior of the inductor, the circuitry comprising a plurality of transistors, wherein the first end of the inductor is electrically coupled to the circuitry in the interior of the inductor, and a footprint of the circuitry is inside a footprint of the inductor; and

a circuit board, wherein the IC package is coupled to the circuit board.

16. The computing device of claim 15 , wherein the IC package is a flip chip package.

17. The computing device of claim 15 , further comprising:

a wireless communications device.