Patent Assignment
Reel/Frame 043452/0871
Assignment of Assignor's Interest
Recorded: 2017-08-30
Pages: 3
Assignor
HU, IAN
Executed: 2017-08-29
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure, Semiconductor Device and Method for Manufacturing the Same