Patent Assignment
Reel/Frame 043460/0160
Assignment of Assignor's Interest
Recorded: 2017-08-31
Pages: 6
Assignors
CHEN, HUAN-NENG
Executed: 2017-07-20
JOU, CHEWN-PU
Executed: 2017-07-20
KUO, FENG WEI
Executed: 2017-07-20
CHO, LAN-CHOU
Executed: 2017-07-20
LIAO, WEN-SHIANG
Executed: 2017-07-21
KIM, YANGHYO
Executed: 2017-08-07
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
THE UNIVERSITY OF CALIFORNIA, LOS ANGELES (UCLA)
405 HILGARD AVENUE, LOS ANGELES, CALIFORNIA, 90095
Covered Property
(1)
Multiband QAM Interface for Slab Waveguide
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Receiving Party Data Previously Recorded at Reel: 43460 Frame: 160. Assignor(S) Hereby Confirms the Assignment.
Jul 3, 2025
From: CHEN, HUAN-NENG; JOU, CHEWN-PU; KUO, FENG WEI; CHO, LAN-CHOU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED; THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Reel/Frame 071815/0020 →
Assignment of Assignor's Interest
Jul 9, 2025
From: CHEN, HUAN-NENG; JOU, CHEWN-PU; KUO, FENG WEI; CHO, LAN-CHOU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED; THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Reel/Frame 071643/0185 →