Patent Assignment
Reel/Frame 043493/0078
Assignment of Assignor's Interest
Recorded: 2017-09-06
Pages: 16
Assignors
CHENG, CHI-HSUAN
Executed: 2017-09-01
CHIU, CHENG-PU
Executed: 2017-09-01
SU, YU-CHIH
Executed: 2017-09-01
WANG, CHIH-YI
Executed: 2017-09-01
HSIEH, CHIN-YANG
Executed: 2017-09-01
HSU, TIEN-SHAN
Executed: 2017-09-01
WANG, YAO-JHAN
Executed: 2017-09-01
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same