Patent Assignment
Reel/Frame 043549/0808
Assignment of Assignor's Interest
Recorded: 2017-09-12
Pages: 5
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Chip Package with Resilient Conductive Paste Post and Fabrication Method Thereof