Patent Assignment
Reel/Frame 043571/0462
Assignment of Assignor's Interest
Recorded: 2017-09-13
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
System on Integrated Chips and Methods of Forming the Same