Patent Assignment
Reel/Frame 043605/0545
Assignment of Assignor's Interest
Recorded: 2017-09-15
Pages: 3
Assignor
SANDOH, HIDEYUKI
Executed: 2017-08-18
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Method of Processing Wafer