Method of processing wafer
A method of processing a wafer includes forming a mask on portions of a face side of the wafer which correspond to devices; performing plasma etching on the face side of the wafer through the mask to etch areas of streets other than areas thereof corresponding to metal components, thereby forming grooves in the areas of the streets to a depth corresponding to a finished thickness of device chips; bonding a protective member for protecting the face side of the wafer, holding the face side of the wafer on a chuck table through the protective member and grinding a reverse side of the wafer until bottoms of the grooves are exposed, to fragmentize the wafer into the device chips; and picking up the device chips from the protective member, leaving remaining regions of the substrate which correspond to the metal components on the protective member.
1. A method of processing a wafer to divide the wafer along a grid-like pattern of streets thereon, the wafer having a plurality of devices formed in respective areas demarcated by the streets on a face side of a substrate, with metal components formed in areas overlapping the streets, comprising:
a mask forming step of forming a mask on portions of a face side of the wafer which correspond to the devices;
a groove forming step of performing plasma etching on the face side of the wafer through the mask to etch areas of the streets other than areas thereof corresponding to the metal components after performing the mask forming step, thereby forming two grooves in each of the streets having metal components to a depth corresponding to a finished thickness of device chips;
a bonding step of bonding a protective member to the face side of the wafer after performing the groove forming step;
a fragmentizing step of holding the face side of the wafer on a chuck table through the protective member and grinding a reverse side of the wafer until bottoms of the grooves are exposed, thereby to fragmentize the wafer into the device chips; and
a pick-up step of picking up the device chips from the protective member, leaving remaining regions of the substrate which correspond to the metal components on the protective member,
wherein, between the groove forming step and the fragmentizing step, the metal components remain on parts of the substrate between the two grooves in the streets.
2. A method of processing a wafer to divide the wafer along a grid-like pattern of streets thereon, the wafer having a plurality of devices formed in respective areas demarcated by the streets on a face side of a substrate and a passivation film deposited on respective face sides of the devices, with metal components formed in areas overlapping the streets, comprising:
a groove forming step of performing plasma etching on the face side of the wafer through the passivation film used as a mask to etch areas of the streets other than areas thereof corresponding to the metal components, thereby forming two grooves in each of the streets having metal components to a depth corresponding to a finished thickness of device chips;
a bonding step of bonding a protective member to the face side of the wafer after performing the groove forming step;
a fragmentizing step of holding the face side of the wafer on a chuck table through the protective member and grinding a reverse side of the wafer until bottoms of the grooves are exposed, thereby to fragmentize the wafer into the device chips; and
a pick-up step of picking up the device chips from the protective member, leaving remaining regions of the substrate which correspond to the metal components on the protective member,
wherein, between the groove forming step and the fragmentizing step, the metal components remain on parts of the substrate between the two grooves in the streets.
3. A method of processing a wafer to divide the wafer along a grid-like pattern of streets thereon, the wafer having a plurality of devices formed in respective areas demarcated by the streets on a face side of a substrate, with metal components formed in areas overlapping the streets, comprising:
a mask forming step of forming a mask on portions of a face side of the wafer which correspond to the devices;
a groove forming step of performing plasma etching on the face side of the wafer through the mask to etch areas of the streets other than areas thereof corresponding to the metal components after performing the mask forming step, thereby forming two grooves in each of the streets having metal components to a depth corresponding to a finished thickness of device chips;
a bonding step of bonding a protective member to the face side of the wafer after performing the groove forming step;
a fragmentizing step of holding the face side of the wafer on a chuck table through the protective member and grinding a reverse side of the wafer until bottoms of the grooves are exposed, thereby to fragmentize the wafer into the device chips; and
a pick-up step of picking up the device chips from the protective member, leaving remaining regions of the substrate which correspond to the metal components on the protective member,
wherein:
the wafer includes a substrate and a plurality of insulating films and a plurality of circuits, wherein the insulating films and the circuits are provided on the face side of the substrate; and
the two grooves formed in each of the streets during the groove forming step extend into the substrate.
4. A method of processing a wafer to divide the wafer along a grid-like pattern of streets thereon, the wafer having a plurality of devices formed in respective areas demarcated by the streets on a face side of a substrate and a passivation film deposited on respective face sides of the devices, with metal components formed in areas overlapping the streets, comprising:
a groove forming step of performing plasma etching on the face side of the wafer through the passivation film used as a mask to etch areas of the streets other than areas thereof corresponding to the metal components, thereby forming two grooves in each of the streets having metal components to a depth corresponding to a finished thickness of device chips;
a bonding step of bonding a protective member to the face side of the wafer after performing the groove forming step;
a fragmentizing step of holding the face side of the wafer on a chuck table through the protective member and grinding a reverse side of the wafer until bottoms of the grooves are exposed, thereby to fragmentize the wafer into the device chips; and
a pick-up step of picking up the device chips from the protective member, leaving remaining regions of the substrate which correspond to the metal components on the protective member,
wherein:
the wafer includes a substrate and a plurality of insulating films and a plurality of circuits, wherein the insulating films and the circuits are provided on the face side of the substrate; and
the two grooves formed in each of the streets during the groove forming step extend into the substrate.