Patent Assignment
Reel/Frame 043609/0369
Assignment of Assignor's Interest
Recorded: 2017-09-15
Pages: 6
Assignors
SONG, JUNGWOO
Executed: 2017-06-07
LEE, YE-RO
Executed: 2017-08-10
HWANG, KWANGTAE
Executed: 2017-06-07
KIM, KWANGMIN
Executed: 2017-06-07
KIM, YONG KWAN
Executed: 2017-06-07
KIM, JIYOUNG
Executed: 2017-08-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device Having Capping Pattern Defining Top Surface of Air Gap