Patent Assignment
Reel/Frame 043632/0799
Assignment of Assignor's Interest
Recorded: 2017-09-19
Pages: 11
Assignors
APPELT, BERND KARL
Executed: 2017-07-14
ESSIG, KAY STEFAN
Executed: 2017-07-17
CHIU, CHI-TSUNG
Executed: 2017-08-08
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Device and Method of Manufacturing the Same