Patent Assignment
Reel/Frame 043662/0719
Assignment of Assignor's Interest
Recorded: 2017-09-22
Pages: 4
Assignors
CHEN, YING-JU
Executed: 2017-08-18
YU, CHEN-HUA
Executed: 2017-08-18
CHEN, MING-FA
Executed: 2017-08-18
CHEN, HSIEN-WEI
Executed: 2017-08-18
HU, CHIH-CHIA
Executed: 2017-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure and Method
Patent:
10,157,867 →
Application:
15/692,067 →