Patent Assignment
Reel/Frame 043721/0827
Assignment of Assignor's Interest
Recorded: 2017-09-28
Pages: 3
Assignor
INOUE, HAJIME
Executed: 2017-06-20
Assignee
HENKEL AG & CO. KGAA
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property
(1)
Sinterable Bonding Material and Semiconductor Device Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.