Sinterable bonding material and semiconductor device using the same
An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.
1. A sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less and an aspect ratio of 20-200; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more.
2. The sinterable bonding material according to claim 1 , wherein a content of the silver filler is 90% by mass or more and 99.9% by mass or less of the total mass of solid components of the bonding material.
3. The sinterable bonding material according to claim 1 , wherein the elastic modulus (E) of the resin particles is 100 MPa or less.
4. The sinterable bonding material according to claim 1 , wherein the resin particles comprise silicone rubber particles and/or fluororubber particles.
5. The sinterable bonding material according to claim 1 , wherein the silver filler comprises a crystalline flake-shaped filler.
6. The sinterable bonding material according to claim 1 , further comprising an additive agent.
7. The sinterable bonding material according to claim 1 , further comprising a solvent.
8. A silver sintered product comprising resin particles dispersed therein and silver filler, wherein the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more, and wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less and an aspect ratio of 20-200.
9. The silver sintered product according to claim 8 , having an average porosity of 10% or less.
10. A bonded article bonded by the silver sintered product according, to claim 8 .
11. A method for manufacturing a semiconductor device comprising the steps of:
providing two members to be bonded;
disposing the two members and a bonding material so that surfaces to be bonded of the two members face to each other with the bonding material disposed therebetween; and
heating the two members with the bonding material disposed therebetween to a predetermined temperature,
wherein the bonding material is a sinterable bonding material comprising a silver filler and resin particles, wherein
the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less and an aspect ratio of 20-200; and
the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more.
12. A silver sintered product comprising a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less and an aspect ratio of 20-200 and resin particles dispersed therein wherein the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more.