Patent Assignment
Reel/Frame 043721/0842
Assignment of Assignor's Interest
Recorded: 2017-09-28
Pages: 3
Assignor
TAKANO, TADASHI
Executed: 2017-06-20
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property
(1)
Sinterable Bonding Material and Semiconductor Device Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.