Patent Assignment
Reel/Frame 043742/0557
Assignment of Assignor's Interest
Recorded: 2017-09-29
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2017-09-15
YEH, SUNG-FENG
Executed: 2017-09-15
CHEN, MING-FA
Executed: 2017-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure for Heat Dissipation