Patent Assignment
Reel/Frame 043746/0098
Assignment of Assignor's Interest
Recorded: 2017-09-29
Pages: 4
Assignors
ALEKSOV, ALEKSANDAR
Executed: 2017-09-22
DARMAWIKARTA, KRISTOF
Executed: 2017-09-22
SARKAR, ARNAB
Executed: 2017-09-22
TANAKA, HIROKI
Executed: 2017-09-22
MAY, ROBERT A.
Executed: 2017-09-22
BOYAPATI, SRI RANGA SAI
Executed: 2017-09-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Substrate First-Level-Interconnect Architecture
Patent:
10,121,679 →
Application:
15/721,384 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.