Patent Assignment
Reel/Frame 043760/0064
Assignment of Assignor's Interest
Recorded: 2017-10-03
Pages: 3
Assignor
HUNG, CHING-WEN
Executed: 2017-09-29
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Fabrication Method Thereof