Patent Assignment
Reel/Frame 043824/0600
Assignment of Assignor's Interest
Recorded: 2017-10-10
Pages: 3
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
Covered Property
(1)
Three Dimensional Semiconductor Memory Device in Which a Channel Layer Has a Stacked Structure Including an Outer Semiconductor Layer and a Doped Inner Semiconductor Layer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name and Address
Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
Merger
Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
Change of Name and Address
Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →