Patent Assignment
Reel/Frame 043827/0774
Assignment of Assignor's Interest
Recorded: 2017-10-10
Pages: 3
Assignor
UTSUNOMIYA, HIROYUKI
Executed: 2016-02-06
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof