Patent Assignment
Reel/Frame 043866/0716
Assignment of Assignor's Interest
Recorded: 2017-10-15
Pages: 10
Assignors
CHEN, SHIH-HSIEN
Executed: 2017-10-13
WANG, MENG-JUN
Executed: 2017-10-13
WANG, TING-CHUN
Executed: 2017-10-13
CHANG, CHIH-SHENG
Executed: 2017-10-13
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Metal Interconnect Structure and Method for Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.