Patent Assignment
Reel/Frame 043870/0242
Assignment of Assignor's Interest
Recorded: 2017-10-16
Pages: 4
Assignors
SUO, PENG
Executed: 2017-08-21
GU, YU
Executed: 2017-08-21
SEE, GUAN HUEI
Executed: 2017-08-21
SUNDARRAJAN, ARVIND
Executed: 2017-08-22
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Method of Increasing Embedded 3D Metal-Insulator-Metal (Mim) Capacitor Capacitance Density for Wafer Level Packaging
Application:
15/673,478 →
Publication:
US 2019/0051596
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.