Patent Assignment
Reel/Frame 043884/0310
Assignment of Assignor's Interest
Recorded: 2017-10-17
Pages: 4
Assignor
MATSUURA, YOSHINORI
Executed: 2017-08-04
Assignee
MITSUI MINING & SMELTING CO., LTD.
11-1-1, OSAKI, SHINAGAWA-KU, TOKYO, 141-8584, JAPAN
Covered Property
(1)
Surface-Treated Copper Foil, Manufacturing Method Therefor, Printed Circuit Board Copper-Clad Laminate, and Printed Circuit Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Address of the Assignee Previously Recorded on Reel 043884 Frame 0310. Assignor(S) Hereby Confirms the Assignment.
Dec 4, 2017
From: MATSUURA, YOSHINORI
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 044680/0793 →
Change of Name
Mar 31, 2026
From: MITSUI MINING AND SMELTING COMPANY, LIMITED
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 075357/0342 →