Corrective Assignment to Correct the Address of the Assignee Previously Recorded on Reel 043884 Frame 0310. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2017-12-04 Pages: 7

Assignor

MATSUURA, YOSHINORI

Executed: 2017-08-04

Assignee

1-11-1, OSAKI, SHINAGAWA-KU, TOKYO, 141-8584, JAPAN

Covered Property (1)

Surface-Treated Copper Foil, Manufacturing Method Therefor, Printed Circuit Board Copper-Clad Laminate, and Printed Circuit Board

Patent: 10,763,002 →

Application: 15/567,166 →

Publication: US 2018/0151268

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.