Patent Assignment
Reel/Frame 043911/0329
Assignment of Assignor's Interest
Recorded: 2017-10-20
Pages: 3
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG),YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof