Patent Assignment
Reel/Frame 043911/0674
Assignment of Assignor's Interest
Recorded: 2017-10-20
Pages: 5
Assignors
PRAJUCKAMOL, ATAPOL
Executed: 2017-10-20
WANG, SW
Executed: 2017-10-20
TAN, KAI CHAT
Executed: 2017-10-20
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL RD., MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Package with Grounding Device and Related Methods
Patent:
10,056,317 →
Application:
15/789,120 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →