Patent Assignment
Reel/Frame 043928/0594
Assignment of Assignor's Interest
Recorded: 2017-10-24
Pages: 5
Assignors
LIU, MING-KAI
Executed: 2017-09-26
PU, HAN-PING
Executed: 2017-09-26
KO, TING-CHU
Executed: 2017-09-27
CHIANG, YUNG-PING
Executed: 2017-09-26
HUANG, CHANG-WEN
Executed: 2017-09-26
HSIEH, YU-SHENG
Executed: 2017-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same