Patent Assignment
Reel/Frame 043937/0716
Assignment of Assignor's Interest
Recorded: 2017-10-24
Pages: 7
Assignors
JIN, JEONG-GI
Executed: 2017-03-17
LEE, NAE-IN
Executed: 2017-03-20
PARK, JUM-YONG
Executed: 2017-03-17
CHUN, JIN-HO
Executed: 2017-03-17
SON, SEONG-MIN
Executed: 2017-03-20
LEE, HO-JIN
Executed: 2017-03-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip