Patent Assignment
Reel/Frame 043980/0898
Assignment of Assignor's Interest
Recorded: 2017-10-30
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package