IP Library Assignment 043998/0188
Patent Assignment
Reel/Frame 043998/0188

Assignment of Assignor's Interest

Recorded: 2017-10-31 Pages: 2
Assignors
YADA, TAKAHIRO
Executed: 2017-10-31
TAKAHASHI, TORU
Executed: 2017-10-31
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Heat Sink Attached to an Electronic Component in a Packaged Device
Application: 15/799,941 →
Publication: US 2019/0131219
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →