Patent Assignment
Reel/Frame 044011/0029
Assignment of Assignor's Interest
Recorded: 2017-11-01
Pages: 4
Assignor
ONITSUKA, YOSHITOMO
Executed: 2017-10-06
Assignee
KYOCERA CORPORATION
6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SHI, KYOTO, 612-8501, JAPAN
Covered Property
(1)
Multi-Piece Wiring Substrate, Wiring Substrate, and Method for Manufacturing Multi-Piece Wiring Substrate