Multi-piece wiring substrate, wiring substrate, and method for manufacturing multi-piece wiring substrate

1. A multi-piece wiring substrate, comprising:

a matrix substrate including a first principal face and a second principal face opposite to the first principal face, the matrix substrate being provided with a plurality of wiring substrate regions,

the matrix substrate being provided with dividing grooves arranged along boundaries of the wiring substrate regions in the first principal face and the second principal face,

the dividing grooves including

first dividing grooves located along respective first sides of the wiring substrate regions in the first principal face,

second dividing grooves arranged in the second principal face so as to be opposite to the first dividing grooves, respectively,

third dividing grooves located along respective second sides of the wiring substrate regions in the first principal face, and

fourth dividing grooves arranged in the second principal face so as to be opposite to the third dividing grooves, respectively,

depths of the first dividing grooves and depths of the second dividing grooves being set to be greater than depths of the third dividing grooves and depths of the fourth dividing grooves,

first curved parts being provided so that the depths of the third dividing grooves gradually increase as going toward respective corners of the wiring substrate regions, the first curved parts being convexly curved toward the respective corners of the wiring substrate regions, the first curved parts being separated from each other by the third dividing grooves,

second curved parts being provided so that the depths of the fourth dividing grooves gradually increase as going toward the respective corners of the wiring substrate regions, the second curved parts being convexly curved toward the respective corners of the wiring substrate regions, the second curved parts being separated from each other by the fourth dividing grooves.

2. The multi-piece wiring substrate according to claim 1 , wherein

on the first principal surface side, a first curved surface is provided between a first side surface exposed along each of the first sides and a second side surface exposed along each of the second sides,

on the second principal surface side, a second curved surface is provided between a third side surface exposed along each of the first sides and a fourth side surface exposed along each of the second sides, and

the first curved surface and the second curved surface individually have a width gradually decreasing as going toward a center part of the multi-piece wiring substrate in the thickness direction thereof in each of the wiring board regions.

3. The multi-piece wiring substrate according to claim 2 , wherein

a first bottom part is provided in a region where each of the first dividing grooves and each of the third dividing grooves intersect with each other,

in a transparent plan view of the multi-piece wiring substrate, the first bottom part is located within a first imaginary circle whose center is located in a first intersection part where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other and whose radius is equal to a length between the first intersection part and one end part of each of the second curved parts where the depth of each of the fourth dividing grooves is smallest,

a second bottom part is provided in a region where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other, and

in a transparent plan view of the multi-piece wiring substrate, the second bottom part is located within a second imaginary circle whose center is located in a second intersection part where each of the first dividing grooves and each of the third dividing grooves intersect with each other and whose radius is equal to a length between the second intersection part and one end part of each of the first curved parts where the depth of each of the third dividing grooves is smallest.

4. The multi-piece wiring substrate according to claim 1 , wherein

a first bottom part is provided in a region where each of the first dividing grooves and each of the third dividing grooves intersect with each other,

in a transparent plan view of the multi-piece wiring substrate, the first bottom part is located within a first imaginary circle whose center is located in a first intersection part where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other and whose radius is equal to a length between the first intersection part and one end part of each of the second curved parts where the depth of each of the fourth dividing grooves is smallest,

a second bottom part is provided in a region where each of the second dividing grooves and each of the fourth dividing grooves intersect with each other, and

in a transparent plan view of the multi-piece wiring substrate, the second bottom part is located within a second imaginary circle whose center is located in a second intersection part where each of the first dividing grooves and each of the third dividing grooves intersect with each other and whose radius is equal to a length between the second intersection part and one end part of each of the first curved parts where the depth of each of the third dividing grooves is smallest.